ASUS Intros Maximus VI Formula With CrossChill Cooling – Features ROG Armor

infopc | June 5, 2013 | Technology | No Comments

ASUS Intros Maximus VI Formula With CrossChill Cooling – Features ROG Armor

ASUS announced their latest Maximus VI Formula motherboard at the Computex 2013 conference. The new Z87 chipset based ROG Formula motherboard comes with the latest CrossChill Cooling technology and features ROG armor.

ASUS Adds the Maximus VI Formula To Their ROG Z87 Lineup

The ASUS Maximus VI Formula is a high-end motherboard design for
overclockers. The motherboard comes with the LGA 1150 socket to support
the latest Intel Haswell processors and combines the Z87 chipset. With the new motherboard, ASUS has gone all out with new cooling solutions
such as the ROG Armor, a thermal armor that’s similar in design to what
we see on ASUS’s Z87 TUF motherboard series but comes in Dual-Cover
design with a strong SECC steel fortifier with thermal pad cooling that
can be equipped on both sides of the board.
If that’s not enough, then the motherboard also incorporates the
CrossChill Cooling technology which allows PC’s with liquid cooling to
offer superior cooling performance to the VRMs by equipping it with the
heatsinks located on the PWM supply phase. The CPU socket is provided
juice through an 8 Pin and 4 Pin connectors, the PWM supply layout is similar to the one we saw on ASUS’s Z87 Maximus VI Extreme.

Expansion slots on the
motherboard include three PCI-e 3.0 x16 and three PCI-e 3.0 x1 slots
while for storage the motherboard offers 10 SATA ports all of which are 6
Gbps compliant. The motherboard also comes with Supreme FX fro mASUS
which allows high quality audio out of the 8.1 channel audio jack featuring OP AMP tech, Supreme FX shielding, 120dB SNR and 600 Ohm Hi-Fi headphone AMP.

Maximus VI Formula with CrossChill cooling

ROG Maximus VI Formula is the ultimate gaming motherboard, with a
stylish ROG Armor cover and a SECC (Steel, Electro-galvanized,
Cold-rolled, Coil) backplate with thermal pads for added strength and
cooling. Maximus VI Formula features the CrossChill hybrid thermal
design, which offers the option of both air and liquid cooling.
Integrated ‘Pin-finned’ heatsinks improve heat dissipation with an
increased surface area, while twin G1/4-inch threaded sockets support
any standard liquid cooling loop. ROG testing has shown that a
liquid-cooled Maximus VI Formula motherboard with CrossChill operates at
temperatures up to 23 degrees Celsius lower than air-only cooling.

Overclocking performance is also enhanced by Extreme Engine Digi+
III power delivery, featuring 60A BlackWing chokes, 90% efficiency
NexFET MOSFETs and 10K Black Metallic capacitors. A bundled mPCIe Combo
II card also provides 802.11ac Wi-Fi and Bluetooth 4.0 wireless, plus an
M.2 interface for ultra-compact NGFF (Next Generation Form-Factor)
SSDs.

Maximus VI Formula raises the bar yet again with SupremeFX
onboard audio. This features 120dB SNR headphone output with a 600ohm
headphone amplifier, and renowned WIMA and ELNA audio capacitors.
Differential signal processing with OpAMP and EMI shielding reduce
electromagnetic interference, too.

Tags:Hardware