IDF13: Intel To Ship 10nm Chips in 2015, 7nm Chips in 2017

While next year’s 14nm chip Broadwell
would be a die shrink of the current Haswell architecture, it would
bring improved graphics performance and power efficiency along with
features like SATA Express. The 14nm Skylake would
be based off a totally new architecture featuring support for DDR4
memory, AVX 3.2, PCIe 4.0 along with improved graphics and IPC
performance. The SOC would also allow for low-power and efficient
designs which would help deliver new products in the mobile market which
Intel is currently focused on. You can see more on Skylake here.

The 10nm chips that arrives after Skylake would be a die shrink of
the former codenamed Skymont. Its not known what capabilities would the
10nm chips hold in terms of performance but it would be the most power
efficient processor to be released and would prove to be really well for
the tablets and mobile market. The 10nm chips would start shipping in
2015 with availability in 2016. After a tick-tock cycle of the 10nm
chips, Intel would ship the 7nm chips in 2017 which would bring a new
level of power efficiency to the Intel next generation
micro-architecture. All in all, its a good thing to know that Intel is
still keeping their tick-tock strategy alive and advancing the PC sector
as a whole.

This article originally appeared on WCCFTech (Link)